Issued Patents 2018
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163866 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, An-Jhih Su | 2018-12-25 |
| 10163800 | Package structure with dummy feature in passivation layer | Hsien-Wei Chen | 2018-12-25 |
| 10157854 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2018-12-18 |
| 10147691 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen | 2018-12-04 |
| 10134685 | Integrated circuit package and method of fabricating the same | Hsien-Wei Chen | 2018-11-20 |
| 10068887 | Semiconductor packages and methods of forming the same | Hsien-Wei Chen | 2018-09-04 |
| 10070497 | Smart lighting system and control method thereof | Liang WANG, Zhixian Zhou, Yang Hu, Tianhang Zheng, Jian Wang +4 more | 2018-09-04 |
| 10069103 | Organic light emitting diode package, method for manufacturing the same, and display device | Pengjie Xiao, Wei-Sheng Yu | 2018-09-04 |
| 10051282 | Method for obtaining motion information with motion vector differences | Il-koo Kim | 2018-08-14 |
| 10037955 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen | 2018-07-31 |
| 10037953 | Contact pad for semiconductor devices | Hsien-Wei Chen, Ying-Ju Chen | 2018-07-31 |
| 10037962 | Ball height control in bonding process | Tsung-Yuan Yu, Hsien-Wei Chen | 2018-07-31 |
| 10037963 | Package structure and method of forming the same | Chen-Hua Yu, Hsien-Wei Chen, Der-Chyang Yeh | 2018-07-31 |
| 10026704 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2018-07-17 |
| 10020271 | Calibration kits for RF passive devices | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2018-07-10 |
| 9997465 | Semiconductor package structure | Hsien-Wei Chen | 2018-06-12 |
| 9991247 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Ying-Ju Chen, Hsien-Wei Chen | 2018-06-05 |
| 9958717 | Method of adjusting display size | Dike Shan, Shih Ying Sun | 2018-05-01 |
| 9947626 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2018-04-17 |
| 9941228 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2018-04-10 |
| 9935084 | Devices and methods of packaging semiconductor devices | Hsien-Wei Chen | 2018-04-03 |
| 9929126 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2018-03-27 |
| 9916218 | Method and apparatus for intercepting implanted information in application | — | 2018-03-13 |
| 9881857 | Pad design for reliability enhancement in packages | Hsien-Wei Chen | 2018-01-30 |