Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079213 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Ming-Da Cheng, Wen-Hsiung Lu | 2018-09-18 |
| 10043770 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2018-08-07 |
| 10037962 | Ball height control in bonding process | Hsien-Wei Chen, Jie Chen | 2018-07-31 |
| 9997483 | Ball amount process in the manufacturing of integrated circuit | Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng | 2018-06-12 |
| 9997480 | Method of forming a semiconductor device including strain reduced structure | Hsien-Wei Chen, Ying-Ju Chen, Yu-Feng Chen, Tsung-Ding Wang | 2018-06-12 |
| 9984965 | Inductor system and method | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2018-05-29 |
| 9978704 | Semiconductor devices with ball strength improvement | Hsien-Wei Chen, Ying-Ju Chen, Shih-Wei Liang | 2018-05-22 |
| 9935070 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |