Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 10128206 | Conductive pillar structure | Chih-Wei Lin, Ming-Da Cheng, Meng-Wei Chou, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-13 |
| 10079213 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2018-09-18 |
| 10062659 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2018-08-28 |
| 10056312 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Yian-Liang Kuo | 2018-08-21 |
| 10050001 | Packaging device and method of making the same | Chang-Chia Huang, Tsung-Shu Lin, Ming-Da Cheng, Bor-Rung Su | 2018-08-14 |
| 10015888 | Interconnect joint protective layer apparatus and method | Cheng-Ting Chen, Hsuan-Ting Kuo, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-07-03 |
| 9997483 | Ball amount process in the manufacturing of integrated circuit | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2018-06-12 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2018-04-03 |
| 9935070 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |