Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062659 | System and method for an improved fine pitch joint | Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2018-08-28 |
| 10015888 | Interconnect joint protective layer apparatus and method | Hsuan-Ting Kuo, Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2018-07-03 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2018-04-03 |