Issued Patents 2018
Showing 1–25 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163865 | Integrated circuit package assembly | — | 2018-12-25 |
| 10163861 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2018-12-25 |
| 10163701 | Multi-stack package-on-package structures | Chi-Jung Lee, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang | 2018-12-25 |
| 10163807 | Alignment pattern for package singulation | Ying-Ju Chen, Der-Chyang Yeh, Shih-Peng Tai | 2018-12-25 |
| 10163661 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2018-12-25 |
| 10163802 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu | 2018-12-25 |
| 10163866 | Semiconductor device and method of manufacture | Ying-Ju Chen, An-Jhih Su, Jie Chen | 2018-12-25 |
| 10163805 | Package structure and method for forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu | 2018-12-25 |
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2018-12-25 |
| 10163862 | Package structure and method for forming same | Kuo-Chuan Liu | 2018-12-25 |
| 10163800 | Package structure with dummy feature in passivation layer | Jie Chen | 2018-12-25 |
| 10157892 | Semiconductor packages and methods of forming the same | Ying-Ju Chen, Wen-Chih Chiou | 2018-12-18 |
| 10157867 | Interconnect structure and method | Ying-Ju Chen, Chen-Hua Yu, Ming-Fa Chen, Chih-Chia Hu | 2018-12-18 |
| 10157854 | Eliminate sawing-induced peeling through forming trenches | Jie Chen | 2018-12-18 |
| 10157825 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2018-12-18 |
| 10153240 | Method of packaging semiconductor devices | Chun-Lin Lu, Kai-Chiang Wu, Hung-Jui Kuo | 2018-12-11 |
| 10147692 | Package with UBM and methods of forming | Li-Hsien Huang | 2018-12-04 |
| 10147691 | Semiconductor structure and manufacturing method thereof | Jie Chen | 2018-12-04 |
| 10141280 | Mechanisms for forming package structure | — | 2018-11-27 |
| 10141288 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2018-11-27 |
| 10134685 | Integrated circuit package and method of fabricating the same | Jie Chen | 2018-11-20 |
| 10121749 | Method of fabricating a post-passivation interconnect structure | Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2018-11-06 |
| 10109607 | Under bump metallurgy (UBM) and methods of forming same | Wei-Yu Chen, An-Jhih Su, Cheng-Hsien Hsieh | 2018-10-23 |
| 10096553 | Metal pad for laser marking | An-Jhih Su | 2018-10-09 |
| 10096563 | Semiconductor package and method of forming the same | An-Jhih Su | 2018-10-09 |