Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163701 | Multi-stack package-on-package structures | Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang | 2018-12-25 |
CL
Chi-Jung Lee
Overall (2018): #458,925 of 503,207Top 95%
1
Patents 2018