Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163701 | Multi-stack package-on-package structures | Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Li-Hsien Huang | 2018-12-25 |
| 10090284 | Semiconductor device and method of manufacture | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2018-10-02 |
| 9941248 | Package structures, pop devices and methods of forming the same | An-Jhih Su, Hsien-Wei Chen, Jo-Mei Wang, Wei-Yu Chen | 2018-04-10 |
| 9929069 | Semiconductor device and manufacturing method thereof | Lin-Chih Huang, Hsien-Wei Chen, An-Jhih Su, Li-Hsien Huang | 2018-03-27 |
| 9922939 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su, Jo-Mei Wang | 2018-03-20 |
| 9859258 | Semiconductor device and method of manufacture | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2018-01-02 |