Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941248 | Package structures, pop devices and methods of forming the same | Tien-Chung Yang, An-Jhih Su, Hsien-Wei Chen, Wei-Yu Chen | 2018-04-10 |
| 9922939 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2018-03-20 |