Issued Patents 2018
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163824 | Integrated fan-out package and method of fabricating the same | Shou-Zen Chang, Chung-Hao Tsai, Chuei-Tang Wang, Ming-Kai Liu | 2018-12-25 |
| 10163854 | Package structure and method for manufacturing thereof | Chuei-Tang Wang, Chieh-Yen Chen, Yen-Ping Wang, Shou-Zen Chang | 2018-12-25 |
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2018-12-25 |
| 10157900 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Hsin-Yu Pan, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao | 2018-12-18 |
| 10157859 | Semiconductor device structure | Shou-Zen Chang, Chi-Ming Huang, Sen-Kuei Hsu, Hsin-Yu Pan, Han-Ping Pu +1 more | 2018-12-18 |
| 10153240 | Method of packaging semiconductor devices | Chun-Lin Lu, Hsien-Wei Chen, Hung-Jui Kuo | 2018-12-11 |
| 10136115 | Video shooting method and apparatus | Wei Liu | 2018-11-20 |
| 10109605 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2018-10-23 |
| 10079200 | Packaging devices and methods | Shih-Wei Liang, Ming-Che Ho, Yi-Wen Wu | 2018-09-18 |
| 10050013 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen +1 more | 2018-08-14 |
| 10049990 | Solder ball protection in packages | Chia-Chun Miao, Shih-Wei Liang | 2018-08-14 |
| 10043761 | Semiconductor device and manufacturing method thereof | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2018-08-07 |
| 10037959 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang, Ming-Kai Liu | 2018-07-31 |
| 10008467 | Semiconductor structure and manufacturing method thereof | Chun-Lin Lu | 2018-06-26 |
| 9966321 | Methods and apparatus for package with interposers | Chun-Lin Lu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2018-05-08 |
| 9953942 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2018-04-24 |
| 9953966 | Semiconductor device and method of forming the same | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang | 2018-04-24 |
| 9941140 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Chun-Lin Lu, Hung-Jui Kou | 2018-04-10 |
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Ming-Kai Liu, Chun-Lin Lu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2018-04-10 |
| 9900739 | Method and apparatus for identifying a target geographic area | Donghui Zhao, Guojun TONG | 2018-02-20 |
| 9875913 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Yen-Ping Wang | 2018-01-23 |
| 9875972 | Semiconductor device structure and method for forming the same | Shou-Zen Chang, Chi-Ming Huang, Sen-Kuei Hsu, Hsin-Yu Pan, Han-Ping Pu +1 more | 2018-01-23 |
| 9863857 | Device and method for particle complex handling | Xing Su, David J. Liu, Kenneth B. Swartz, Mineo Yamakawa | 2018-01-09 |