Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163837 | Cu pillar bump with L-shaped non-metal sidewall protection structure | Chien Ling Hwang, Chung-Shi Liu | 2018-12-25 |
| 10134700 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-20 |
| 10079200 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Ming-Che Ho | 2018-09-18 |
| 10068853 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2018-09-04 |
| 9953891 | Method of forming post-passivation interconnect structure | Zheng-Yi Lim, Ming-Che Ho, Chung-Shi Liu | 2018-04-24 |
| 9935047 | Bonding structures and methods forming the same | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2018-04-03 |
| 9871009 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Tzung-Hui Lee | 2018-01-16 |
| 9859242 | Post-passivation interconnect structure and method of forming same | Hsien-Wei Chen | 2018-01-02 |