Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163832 | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same | Tzu-Yun Huang | 2018-12-25 |
| 10134700 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-20 |
| 10079200 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Yi-Wen Wu | 2018-09-18 |
| 10074623 | Method of fabricating redistribution circuit structure | Tzung-Hui Lee, Hung-Jui Kuo, Tzu-Yun Huang | 2018-09-11 |
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2018-08-14 |
| 10033987 | Device for generating depth information, method for generating depth information, and stereo camera | Ben Wu, Pei-Chun Yeh | 2018-07-24 |
| 10009595 | Image calibration system and calibration method of a stereo camera | Wen-Kuo Lin | 2018-06-26 |
| 9953891 | Method of forming post-passivation interconnect structure | Yi-Wen Wu, Zheng-Yi Lim, Chung-Shi Liu | 2018-04-24 |
| 9935047 | Bonding structures and methods forming the same | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2018-04-03 |
| 9899342 | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same | Tzung-Hui Lee, Hung-Jui Kuo, Tzu-Yun Huang | 2018-02-20 |
| 9871009 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Yi-Wen Wu, Tzung-Hui Lee | 2018-01-16 |