Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163832 | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same | Ming-Che Ho | 2018-12-25 |
| 10074623 | Method of fabricating redistribution circuit structure | Tzung-Hui Lee, Hung-Jui Kuo, Ming-Che Ho | 2018-09-11 |
| 9899342 | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same | Tzung-Hui Lee, Hung-Jui Kuo, Ming-Che Ho | 2018-02-20 |