Issued Patents 2018
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163858 | Semiconductor packages and manufacturing methods thereof | Zi-Jheng Liu, Chen-Cheng Kuo | 2018-12-25 |
| 10153240 | Method of packaging semiconductor devices | Chun-Lin Lu, Hsien-Wei Chen, Kai-Chiang Wu | 2018-12-11 |
| 10134700 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Chung-Shi Liu | 2018-11-20 |
| 10134699 | Packages with solder ball revealed through layer | Yu-Hsiang Hu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-11-20 |
| 10128206 | Conductive pillar structure | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Meng-Wei Chou, Chung-Shi Liu | 2018-11-13 |
| 10090194 | Semiconductor device and method | Zi-Jheng Liu, Yu-Hsiang Hu | 2018-10-02 |
| 10074623 | Method of fabricating redistribution circuit structure | Tzung-Hui Lee, Ming-Che Ho, Tzu-Yun Huang | 2018-09-11 |
| 10068853 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Yi-Wen Wu | 2018-09-04 |
| 10049986 | Package structures and methods of making the same | Zi-Jheng Liu, Chung-Shi Liu, Yu-Hsiang Hu | 2018-08-14 |
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Chung-Shi Liu +1 more | 2018-08-14 |
| 10032735 | Semiconductor structure and method of forming | Chen-Hua Yu, Yu-Hsiang Hu | 2018-07-24 |
| 9935047 | Bonding structures and methods forming the same | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Alexander Kalnitsky, Ming-Che Ho +3 more | 2018-04-03 |
| 9899248 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng, Yu-Hsiang Hu | 2018-02-20 |
| 9899342 | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same | Tzung-Hui Lee, Ming-Che Ho, Tzu-Yun Huang | 2018-02-20 |
| 9871009 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Yi-Wen Wu, Tzung-Hui Lee | 2018-01-16 |
| 9859206 | Photoactive compound gradient photoresist | Chen-Hua Yu, Chung-Shi Liu | 2018-01-02 |