Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163839 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chita Chuang, Chen-Shien Chen | 2018-12-25 |
| 10163858 | Semiconductor packages and manufacturing methods thereof | Zi-Jheng Liu, Hung-Jui Kuo | 2018-12-25 |
| 9991218 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2018-06-05 |
| 9905524 | Bump structures in semiconductor device and packaging assembly | Chita Chuang, Yao-Chun Chuang, Tsung-Shu Lin, Chen-Shien Chen | 2018-02-27 |
| 9881885 | Metal routing architecture for integrated circuits | Chita Chuang, Chih-Hua Chen, Chen-Shien Chen, Yao-Chun Chuang | 2018-01-30 |