Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163839 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2018-12-25 |
| 10056345 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Sheng-Yu Wu | 2018-08-21 |
| 9991218 | Connector structures of integrated circuits | Shang-Yun Tu, Ming Hung Tseng, Chen-Cheng Kuo, Chen-Shien Chen | 2018-06-05 |
| 9905524 | Bump structures in semiconductor device and packaging assembly | Chita Chuang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2018-02-27 |
| 9881885 | Metal routing architecture for integrated circuits | Chen-Cheng Kuo, Chita Chuang, Chih-Hua Chen, Chen-Shien Chen | 2018-01-30 |