Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163780 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo | 2018-12-25 |
| 10128203 | Fan-out package structure, antenna system and associated method | Wei-Ting Chen, Tzu-Chun Tang, In-Tsang Lin, Vincent Chen, Chuei-Tang Wang +1 more | 2018-11-13 |
| 10115685 | Method of manufacturing a semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2018-10-30 |
| 10097030 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Tzu-Sung Huang, Hung-Yi Kuo | 2018-10-09 |
| 10074472 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Hao-Yi Tsai, Hung-Yi Kuo +1 more | 2018-09-11 |
| 10037973 | Method for manufacturing semiconductor package structure | Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen +1 more | 2018-07-31 |
| 9991218 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2018-06-05 |
| 9953936 | Semiconductor structure and manufacturing method thereof | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2018-04-24 |
| 9859252 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Chen-Shien Chen | 2018-01-02 |