Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037973 | Method for manufacturing semiconductor package structure | Hua-Wei Tseng, Shang-Yun Tu, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng +1 more | 2018-07-31 |
HC
Hsu-Hsien Chen
Overall (2018): #394,167 of 503,207Top 80%
1
Patents 2018