Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037973 | Method for manufacturing semiconductor package structure | Hua-Wei Tseng, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng +1 more | 2018-07-31 |
| 9991218 | Connector structures of integrated circuits | Yao-Chun Chuang, Ming Hung Tseng, Chen-Cheng Kuo, Chen-Shien Chen | 2018-06-05 |