Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037973 | Method for manufacturing semiconductor package structure | Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Chen-Shien Chen, Ming Hung Tseng +1 more | 2018-07-31 |
| 9978656 | Mechanisms for forming fine-pitch copper bump structures | Tsung-Shu Lin, Han-Ping Pu, Ming-Da Cheng, Chang-Chia Huang | 2018-05-22 |