Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10050001 | Packaging device and method of making the same | Tsung-Shu Lin, Ming-Da Cheng, Wen-Hsiung Lu, Bor-Rung Su | 2018-08-14 |
| 9978656 | Mechanisms for forming fine-pitch copper bump structures | Tsung-Shu Lin, Han-Ping Pu, Ming-Da Cheng, Hao-Juin Liu | 2018-05-22 |
| 9953939 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2018-04-24 |