Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153243 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2018-12-11 |
| 10008459 | Structures having a tapering curved profile and methods of making same | Pei-Chun Tsai, Tin-Hao Kuo, Chen-Shien Chen | 2018-06-26 |
| 9966346 | Bump structure and method of forming same | Guan-Yu Chen, Yu-Wei Lin, Tin-Hao Kuo, Chen-Shien Chen | 2018-05-08 |
| 9953939 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Chang-Chia Huang, Tin-Hao Kuo, Chen-Shien Chen | 2018-04-24 |
| 9917035 | Bump-on-trace interconnection structure for flip-chip packages | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2018-03-13 |