Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128195 | Substrate design with balanced metal and solder resist density | Guan-Yu Chen, Yu-Min Liang, Tin-Hao Kuo, Chen-Shien Chen | 2018-11-13 |
| 10043774 | Integrated circuit packaging substrate, semiconductor package, and manufacturing method | Chen-Shien Chen, Guan-Yu Chen, Tin-Hao Kuo, Yen-Liang Lin | 2018-08-07 |
| 10020276 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Feng Chen, Tin-Hao Kuo, Yu-Min Liang, Chun-Hung Lin | 2018-07-10 |
| 10014870 | Micro-electro-mechanical systems (MEMS), apparatus, and operating methods thereof | Yung-Chow Peng, Wen-Hung Huang | 2018-07-03 |
| 9966346 | Bump structure and method of forming same | Guan-Yu Chen, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2018-05-08 |
| 9950021 | Anti-cancer active substance from Antrodia camphorata, method for preparing the same and use thereof | Been-Huang CHIANG | 2018-04-24 |