Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141378 | Light emitting device free of TFT and chiplet | Yi-Ping Lin, Jung-Yu Li, Jin-Han Wu, Cheng-Hung Li, Shih-Pu Chen | 2018-11-27 |
| 10128195 | Substrate design with balanced metal and solder resist density | Yu-Wei Lin, Yu-Min Liang, Tin-Hao Kuo, Chen-Shien Chen | 2018-11-13 |
| 10090575 | Method of manufacturing a waveguide assembly by adhesively bonding two waveguide units and a waveguide structure formed therefrom | Pai-Lee CHANG | 2018-10-02 |
| 10043774 | Integrated circuit packaging substrate, semiconductor package, and manufacturing method | Yu-Wei Lin, Chen-Shien Chen, Tin-Hao Kuo, Yen-Liang Lin | 2018-08-07 |
| 9966346 | Bump structure and method of forming same | Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2018-05-08 |
| 9899288 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Tsung-Hsien Chiang, Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2018-02-20 |