Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153249 | Dual-sided integrated fan-out package | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2018-12-11 |
| 10008479 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Shou-Cheng Hu | 2018-06-26 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2018-04-17 |
| 9935024 | Method for forming semiconductor structure | Pei-Chun Tsai, Tin-Hao Kuo, Hao-Yi Tsai | 2018-04-03 |
| 9899288 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Tsung-Hsien Chiang, Guan-Yu Chen, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2018-02-20 |
| 9870997 | Integrated fan-out package and method of fabricating the same | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Chien Ling Hwang, Tsung-Hsien Chiang +1 more | 2018-01-16 |