Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153249 | Dual-sided integrated fan-out package | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2018-12-11 |
| 10134706 | Warpage control of semiconductor die package | Ching-Wen Hsiao, Chen-Shien Chen | 2018-11-20 |
| 10125014 | Integrated circuit package and method of forming same | Chung-Shi Liu, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng | 2018-11-13 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2018-04-17 |
| 9935081 | Hybrid interconnect for chip stacking | Yu-Feng Chen, Chen-Shien Chen, Mirng-Ji Lii | 2018-04-03 |