Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157846 | Method for forming chip package involving cutting process | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2018-12-18 |
| 10128193 | Package structure and method for forming the same | Chih-Wei Lin, Ching-Yao Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2018-11-13 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2018-04-17 |