Issued Patents 2018
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157846 | Method for forming chip package involving cutting process | Shing-Chao Chen, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2018-12-18 |
| 10150818 | Compositions and methods for treatment and detection of cancers | Chi-Huey Wong, Tsui-Ling Hsu, Yi-Wei Lou, Shih-Chi Yeh, Chung-Yi Wu +1 more | 2018-12-11 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 10128206 | Conductive pillar structure | Ming-Da Cheng, Wen-Hsiung Lu, Meng-Wei Chou, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-13 |
| 10128193 | Package structure and method for forming the same | Shing-Chao Chen, Ching-Yao Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2018-11-13 |
| 10062764 | Semiconductor device having void between gate electrode and sidewall spacer and manufacturing method thereof | Yen-Liang Wu, Wen-Tsung Chang, Jui-Ming Yang, I-Fan Chang, Chun-Ting Chiang +2 more | 2018-08-28 |
| 10040939 | Polyimide film having a low dielectric constant and a low gloss, and method of fabricating the same | Chun-Ting Lai | 2018-08-07 |
| 10043802 | Gate structure with additional oxide layer | Chih-Lin Wang, Kang-Min Kuo, Cheng-Wei Lian | 2018-08-07 |
| 10032734 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2018-07-24 |
| 10015902 | Integrated moveable and lockable rail | Chao-Jung Chen, Chien-Wei Huang | 2018-07-03 |
| 10014260 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-07-03 |
| 9991190 | Packaging with interposer frame | Hui-Min Huang, Yen-Chang Hu, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2018-06-05 |
| 9982041 | Compositions and methods for treatment and detection of cancers | Chi-Huey Wong, Tsui-Ling Hsu, Yi-Wei Lou, Shih-Chi Yeh, Chung-Yi Wu +1 more | 2018-05-29 |
| 9975965 | Compositions and methods for treatment and detection of cancers | Chi-Huey Wong, Tsui-Ling Hsu, Yi-Wei Lou, Shih-Chi Yeh, Chung-Yi Wu +1 more | 2018-05-22 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Hsiu-Jen Lin, Chun-Cheng Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-05-22 |
| 9960246 | Semiconductor structure with insertion layer and method for manufacturing the same | Cheng-Wei Lian, Chih-Lin Wang, Kang-Min Kuo | 2018-05-01 |
| 9958912 | Two rack unit chassis and low profile tool-less hard drive carrier | Chao-Jung Chen, Yaw-Tzorng Tsorng, Chih-Hsiang Lee, Chun Chang, Chia-Wei Huang | 2018-05-01 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Shing-Chao Chen, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2018-04-17 |
| 9935091 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9914841 | Polyimide film incorporating a colored polyimide matting power and manufacture thereof | Wu-Yung Yang | 2018-03-13 |
| 9911674 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9899248 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Ming-Da Cheng, Yu-Hsiang Hu | 2018-02-20 |
| 9898645 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-02-20 |
| 9892962 | Wafer level chip scale package interconnects and methods of manufacture thereof | Cheng-Tar Wu, Chung-Shi Liu, Hui-Min Huang, Chun-Cheng Lin, Ming-Da Cheng | 2018-02-13 |