Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157881 | Methods for controlling warpage in packaging | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2018-12-18 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Ming-Da Cheng, Chung-Shi Liu +6 more | 2018-11-20 |
| 10056285 | Semiconductor wafer device and manufacturing method thereof | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin | 2018-08-21 |
| 10020211 | Wafer-level molding chase design | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng +2 more | 2018-07-10 |
| 9893044 | Wafer-level underfill and over-molding | Chung-Shi Liu, Chien Ling Hwang, Yeong-Jyh Lin | 2018-02-13 |