Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157881 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2018-12-18 |
| 10115690 | Method of manufacturing micro pins and isolated conductive micro pin | Ying-Jui Huang, Chung-Shi Liu, Chien Ling Hwang | 2018-10-30 |
| 10056285 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Yeong-Jyh Lin | 2018-08-21 |
| 9984960 | Integrated fan-out package and method of fabricating the same | Chien Ling Hwang, Ching-Hua Hsieh, Ying-Jui Huang | 2018-05-29 |
| 9870929 | Package structure, fan-out package structure and method of the same | Chien Ling Hwang, Yu-Ting Chiu | 2018-01-16 |
| 9870997 | Integrated fan-out package and method of fabricating the same | Chih-Hao Chang, Hao-Yi Tsai, Chien Ling Hwang, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2018-01-16 |