Issued Patents 2018
Showing 1–25 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163849 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2018-12-25 |
| 10163804 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-12-25 |
| 10163734 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Chun-Hung Lin, Ming-Da Cheng, Mirng-Ji Lii | 2018-12-25 |
| 10163785 | Semiconductor die contact structure and method | Chen-Hua Yu | 2018-12-25 |
| 10163780 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2018-12-25 |
| 10163837 | Cu pillar bump with L-shaped non-metal sidewall protection structure | Chien Ling Hwang, Yi-Wen Wu | 2018-12-25 |
| 10157274 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2018-12-18 |
| 10157893 | Package-on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Mirng-Ji Lii, Ming-Da Cheng | 2018-12-18 |
| 10157881 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang | 2018-12-18 |
| 10157849 | Packages with molding structures and methods of forming the same | Chih-Fan Huang, Cheng-Tar Wu, Ming-Da Cheng, Chen-Hua Yu | 2018-12-18 |
| 10157862 | Integrated fan-out package and method of fabricating the same | Wei-Yu Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Chia-Lun Chang | 2018-12-18 |
| 10157808 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Hua Chen, Hao-Yi Tsai +1 more | 2018-12-18 |
| 10153249 | Dual-sided integrated fan-out package | Kuo Lung Pan, Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai | 2018-12-11 |
| 10153180 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng | 2018-12-11 |
| 10147693 | Methods for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai +2 more | 2018-12-04 |
| 10141281 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen | 2018-11-27 |
| 10134717 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2018-11-20 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 10134699 | Packages with solder ball revealed through layer | Yu-Hsiang Hu, Wei-Yu Chen, Ming-Da Cheng, Hung-Jui Kuo | 2018-11-20 |
| 10134700 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo | 2018-11-20 |
| 10125014 | Integrated circuit package and method of forming same | Kuo Lung Pan, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng | 2018-11-13 |
| 10128206 | Conductive pillar structure | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Meng-Wei Chou, Hung-Jui Kuo | 2018-11-13 |
| 10115690 | Method of manufacturing micro pins and isolated conductive micro pin | Ying-Jui Huang, Hsin-Hung Liao, Chien Ling Hwang | 2018-10-30 |
| 10109618 | Bonding structure between semiconductor device package | James Hu, Ming-Da Cheng | 2018-10-23 |
| 10109612 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng | 2018-10-23 |