Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157849 | Packages with molding structures and methods of forming the same | Chih-Fan Huang, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2018-12-18 |
| 9892962 | Wafer level chip scale package interconnects and methods of manufacture thereof | Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Chun-Cheng Lin, Ming-Da Cheng | 2018-02-13 |