Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10165668 | Heat exchanger for an information handling system | Brandon J. Brocklesby, Yu-Lin Chen | 2018-12-25 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-05-22 |
| 9892962 | Wafer level chip scale package interconnects and methods of manufacture thereof | Cheng-Tar Wu, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng | 2018-02-13 |