Issued Patents 2018
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10159874 | Luminous ball | — | 2018-12-25 |
| 10163804 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Ming-Da Cheng | 2018-12-25 |
| 10153180 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2018-12-11 |
| 10141281 | Substrate and package structure | Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2018-11-27 |
| 10134717 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Ming-Da Cheng | 2018-11-20 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu +6 more | 2018-11-20 |
| 10074433 | Data encoding method, memory control circuit unit and memory storage device | Yu-Cheng Hsu, Yu-Siang Yang | 2018-09-11 |
| 10067824 | Error processing method, memory storage device and memory controlling circuit unit | Yu-Cheng Hsu, Shao-Wei Yen, Tien-Ching Wang, Yu-Hsiang Lin, Kuo-Hsin Lai +1 more | 2018-09-04 |
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2018-08-14 |
| 10025660 | Data reading method, memory control circuit unit and memory storage apparatus | Tien-Ching Wang, Kuo-Hsin Lai | 2018-07-17 |
| 10014260 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-07-03 |
| 9972390 | Two pass memory programming method, memory control circuit unit and memory storage apparatus | Yu-Cheng Hsu, Szu-Wei Chen | 2018-05-15 |
| 9947417 | Memory management method, memory storage device and memory controlling circuit unit | Yu-Cheng Hsu | 2018-04-17 |
| 9941221 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Ming-Da Cheng, Chung-Shi Liu | 2018-04-10 |
| 9935091 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9911633 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-03-06 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2018-03-06 |
| 9911674 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2018-03-06 |
| 9892799 | Read voltage tracking method, memory storage device and memory control circuit unit | Yu-Cheng Hsu, An-Cheng Liu | 2018-02-13 |
| 9891991 | Decoding method, memory storage device and memory control circuit unit | — | 2018-02-13 |
| 9887162 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Ming-Da Cheng | 2018-02-06 |
| 9871018 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Ming-Da Cheng | 2018-01-16 |
| 9865574 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-01-09 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Meng-Tse Chen, Chih-Wei Lin +3 more | 2018-01-02 |