Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153180 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-12-11 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 10109612 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2018-10-23 |
| 9935091 | Package-on-package structures and methods for forming the same | Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2018-01-30 |
| 9865574 | Alignment in the packaging of integrated circuits | Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-01-09 |