Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163849 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2018-12-25 |
| 10157862 | Integrated fan-out package and method of fabricating the same | Wei-Yu Chen, Chung-Shi Liu, Hsiu-Jen Lin, Chia-Lun Chang | 2018-12-18 |
| 10157846 | Method for forming chip package involving cutting process | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng | 2018-12-18 |
| 10128193 | Package structure and method for forming the same | Shing-Chao Chen, Chih-Wei Lin, Ching-Yao Lin, Ming-Da Cheng | 2018-11-13 |
| 10103099 | Semiconductor devices and methods of forming same | Chih-Chien Chi, Huang-Yi Huang, Szu-Ping Tung | 2018-10-16 |
| 10014260 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2018-07-03 |
| 9984960 | Integrated fan-out package and method of fabricating the same | Chien Ling Hwang, Hsin-Hung Liao, Ying-Jui Huang | 2018-05-29 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Hsiu-Jen Lin, Chun-Cheng Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2018-05-22 |
| 9887072 | Systems and methods for integrated resputtering in a physical vapor deposition chamber | Shing-Chyang Pan, Ming-Hsing Tsai, Syun-Ming Jang | 2018-02-06 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng +2 more | 2018-01-30 |
| 9873944 | Metal capping process and processing platform thereof | Chih-Chien Chi, Szu-Ping Tung, Huang-Yi Huang | 2018-01-23 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Meng-Tse Chen, Chih-Wei Lin +3 more | 2018-01-02 |