Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157862 | Integrated fan-out package and method of fabricating the same | Wei-Yu Chen, Ching-Hua Hsieh, Chung-Shi Liu, Hsiu-Jen Lin | 2018-12-18 |
| 10108295 | Input device including sensing electrodes | Chueh-Pin Ko | 2018-10-23 |
| 9935067 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2018-04-03 |