Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157846 | Method for forming chip package involving cutting process | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2018-12-18 |
| 9899288 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Guan-Yu Chen, Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2018-02-20 |
| 9870997 | Integrated fan-out package and method of fabricating the same | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Chien Ling Hwang, Wei Sen Chang +1 more | 2018-01-16 |