Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163754 | Lid design for heat dissipation enhancement of die package | Kuan-Lin Ho, Hsin-Yu Pan, Yu-Chih Liu, Chin-Liang Chen | 2018-12-25 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Meng-Tse Chen, Chih-Wei Lin, Wei-Hung Lin +3 more | 2018-01-02 |