Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163754 | Lid design for heat dissipation enhancement of die package | Sheng-Hsiang Chiu, Hsin-Yu Pan, Yu-Chih Liu, Chin-Liang Chen | 2018-12-25 |
| 10157772 | Semiconductor packaging structure and process | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2018-12-18 |
| 10157863 | Method for forming a lid structure for a semiconductor device package | Chin-Liang Chen, Chi-Yang Yu, Yu-Chih Liu | 2018-12-18 |
| 10157871 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Yu-Min Liang | 2018-12-18 |
| 9941186 | Method for manufacturing semiconductor structure | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2018-04-10 |
| 9893043 | Method of manufacturing a chip package | Chin-Liang Chen, Yu-Chih Liu, Wei-Ting Lin, Shih-Yen Lin | 2018-02-13 |
| 9865566 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang | 2018-01-09 |
| 9859265 | Package structure and methods of forming the same | Yu-Chih Liu, Wei-Ting Lin, Chin-Liang Chen, Jing Ruei Lu | 2018-01-02 |