Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163754 | Lid design for heat dissipation enhancement of die package | Kuan-Lin Ho, Sheng-Hsiang Chiu, Yu-Chih Liu, Chin-Liang Chen | 2018-12-25 |
| 10157859 | Semiconductor device structure | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Han-Ping Pu +1 more | 2018-12-18 |
| 10157900 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao | 2018-12-18 |
| 10020236 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Chen-Hua Yu | 2018-07-10 |
| 9875972 | Semiconductor device structure and method for forming the same | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Han-Ping Pu +1 more | 2018-01-23 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Tsung-Ding Wang, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Han-Ping Pu | 2018-01-02 |