Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157818 | Methods of cooling packaged semiconductor devices | Szu-Po Huang, Shin-Puu Jeng, Wensen Hung | 2018-12-18 |
| 10157813 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2018-12-18 |
| 10062665 | Semiconductor packages with thermal management features for reduced thermal crosstalk | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2018-08-28 |
| 9985001 | 3DIC package and methods of forming the same | Szu-Po Huang, Shin-Puu Jeng, Wensen Hung | 2018-05-29 |
| 9978660 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2018-05-22 |
| 9941251 | 3DIC packages with heat dissipation structures | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2018-04-10 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Tsung-Ding Wang, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan, Han-Ping Pu | 2018-01-02 |