Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157859 | Semiconductor device structure | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Hsin-Yu Pan +1 more | 2018-12-18 |
| 9978656 | Mechanisms for forming fine-pitch copper bump structures | Tsung-Shu Lin, Ming-Da Cheng, Chang-Chia Huang, Hao-Juin Liu | 2018-05-22 |
| 9899982 | On-chip electromagnetic bandgap (EBG) structure for noise suppression | Ming-Hsien Tsai, Chien-Min Lin, Fu-Lung Hsueh, Sa-Lly Liu, Sen-Kuei Hsu | 2018-02-20 |
| 9875972 | Semiconductor device structure and method for forming the same | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Hsin-Yu Pan +1 more | 2018-01-23 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Tsung-Ding Wang, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan | 2018-01-02 |