Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163854 | Package structure and method for manufacturing thereof | Chuei-Tang Wang, Kai-Chiang Wu, Chieh-Yen Chen, Yen-Ping Wang | 2018-12-25 |
| 10163824 | Integrated fan-out package and method of fabricating the same | Chung-Hao Tsai, Chuei-Tang Wang, Kai-Chiang Wu, Ming-Kai Liu | 2018-12-25 |
| 10157807 | Sensor packages and manufacturing mehtods thereof | Yung-Ping Chiang, Chao-Wen Shih, Albert Wan, Yu-Sheng Hsieh | 2018-12-18 |
| 10157859 | Semiconductor device structure | Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Hsin-Yu Pan, Han-Ping Pu +1 more | 2018-12-18 |
| 10050013 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen +1 more | 2018-08-14 |
| 10043761 | Semiconductor device and manufacturing method thereof | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2018-08-07 |
| 10037994 | Semiconductor devices having Fin field effect transistor (FinFET) structures and manufacturing and design methods thereof | Tung Ying Lee, Wen-Huei Guo, Chih-Hao Chang | 2018-07-31 |
| 9978630 | Curved wafer processing method and apparatus | I-Ming Chang, Wen-Huei Guo, Chih-Hao Chang, Clement Hsingjen Wann, Tung Ying Lee +2 more | 2018-05-22 |
| 9875972 | Semiconductor device structure and method for forming the same | Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Hsin-Yu Pan, Han-Ping Pu +1 more | 2018-01-23 |