Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2018-12-25 |
| 10153240 | Method of packaging semiconductor devices | Hsien-Wei Chen, Kai-Chiang Wu, Hung-Jui Kuo | 2018-12-11 |
| 10050013 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2018-08-14 |
| 10043761 | Semiconductor device and manufacturing method thereof | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2018-08-07 |
| 10008467 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu | 2018-06-26 |
| 9966321 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2018-05-08 |
| 9941140 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Kai-Chiang Wu, Hung-Jui Kou | 2018-04-10 |
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Ming-Kai Liu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2018-04-10 |