Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049889 | Method of fabricating package structures | Yu-Hsiang Hu, Chung-Shi Liu, Sih-Hao Liao | 2018-08-14 |
| 9941140 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Kai-Chiang Wu, Chun-Lin Lu | 2018-04-10 |