Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163854 | Package structure and method for manufacturing thereof | Chuei-Tang Wang, Kai-Chiang Wu, Chieh-Yen Chen, Shou-Zen Chang | 2018-12-25 |
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2018-12-25 |
| 10043761 | Semiconductor device and manufacturing method thereof | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2018-08-07 |
| 10037959 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Kai-Chiang Wu, Ming-Kai Liu | 2018-07-31 |
| 9966321 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2018-05-08 |
| 9953966 | Semiconductor device and method of forming the same | Chia-Chun Miao, Shih-Wei Liang, Kai-Chiang Wu | 2018-04-24 |
| 9953942 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang | 2018-04-24 |
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2018-04-10 |
| 9875913 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Kai-Chiang Wu | 2018-01-23 |