Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157807 | Sensor packages and manufacturing mehtods thereof | Yung-Ping Chiang, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2018-12-18 |
| 9953942 | Semiconductor packaging and manufacturing method thereof | Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2018-04-24 |