CM

Chia-Chun Miao

TSMC: 6 patents #345 of 2,904Top 15%
OT Omnivision Technologies: 4 patents #20 of 149Top 15%
📍 Taichung, CA: #4 of 76 inventorsTop 6%
Overall (2018): #7,105 of 503,207Top 2%
10
Patents 2018

Issued Patents 2018

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
10163846 Mechanisms for forming hybrid bonding structures with elongated bumps Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more 2018-12-25
10157900 Semiconductor structure and manufacturing method thereof Shih-Wei Liang, Hsin-Yu Pan, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu 2018-12-18
10147751 Edge reflection reduction Yin Qian, Chao-Hung Lin, Chen Lu, Dyson H. Tai, Ming Zhang +1 more 2018-12-04
10049990 Solder ball protection in packages Shih-Wei Liang, Kai-Chiang Wu 2018-08-14
10037959 Semiconductor structure and manufacturing method thereof Shih-Wei Liang, Yen-Ping Wang, Kai-Chiang Wu, Ming-Kai Liu 2018-07-31
9966404 Edge reflection reduction Yin Qian, Chao-Hung Lin, Chen Lu, Dyson H. Tai, Ming Zhang +1 more 2018-05-08
9966396 High dynamic range image sensor with reduced sensitivity to high intensity light Yin Qian, Ming Zhang, Chen Lu, Jin Li, Dyson H. Tai 2018-05-08
9953966 Semiconductor device and method of forming the same Shih-Wei Liang, Kai-Chiang Wu, Yen-Ping Wang 2018-04-24
9941240 Semiconductor chip scale package and manufacturing method thereof Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more 2018-04-10
9921442 Method for forming an alignment layer of a liquid crystal display device and display device manufactured thereby Yin Qian, Dyson H. Tai, Ming Zhang 2018-03-20