Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062648 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2018-08-28 |
| 10050001 | Packaging device and method of making the same | Chang-Chia Huang, Ming-Da Cheng, Wen-Hsiung Lu, Bor-Rung Su | 2018-08-14 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Chin-Chuan Chang +5 more | 2018-05-29 |
| 9978656 | Mechanisms for forming fine-pitch copper bump structures | Han-Ping Pu, Ming-Da Cheng, Chang-Chia Huang, Hao-Juin Liu | 2018-05-22 |
| 9972581 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2018-05-15 |
| 9941216 | Conductive pattern and integrated fan-out package having the same | Ming-Yen Chiu, Ching Fu Chang, Chien-Chia Chiu, Hsin-Chieh Huang, Pei-Ti Yu | 2018-04-10 |
| 9929112 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Wei-Cheng Wu | 2018-03-27 |
| 9905524 | Bump structures in semiconductor device and packaging assembly | Chita Chuang, Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2018-02-27 |
| 9887144 | Ring structure for chip packaging | Wen-Yi Lin, Yu-Chih Liu, Ming-Chih Yew, Bor-Rung Su, Jing Ruei Lu +1 more | 2018-02-06 |