Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9887144 | Ring structure for chip packaging | Wen-Yi Lin, Yu-Chih Liu, Ming-Chih Yew, Tsung-Shu Lin, Bor-Rung Su +1 more | 2018-02-06 |
| 9859265 | Package structure and methods of forming the same | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Chin-Liang Chen | 2018-01-02 |